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Wafer Bonding 87 4Kommunikationspolitik8

SKU 10929231173
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EUR187.25 EUR221.25

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Description

4Kommunikationspolitik8

Theoretische Betrachtungen

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Wafer Bonding 87 4Kommunikationspolitik8During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state of the art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding based fabrication methods of silicon on insulator, photonic crystals, VCSELs, SiGe based FETs, MEMS together with hybrid integration and laser lift off. The non specialist will

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